imec Automotive Chiplet Program Expansion
GlobalFoundries, Infineon, Silicon Box, STATS ChipPAC, and TIER IV have joined imec's Automotive Chiplet Program (ACP), accelerating the development of cutting-edge chiplet architecture for the automotive industry.
As vehicles become high-performance, software-defined platforms, traditional monolithic chip designs struggle to meet the demands of advanced driver assistance systems (ADAS), autonomous driving, and in-vehicle infotainment.
- GlobalFoundries (GF) joined as a foundry partner
- Infineon, Silicon Box, STATS ChipPAC, and TIER IV also committed to join ACP
imec's network expansion further accelerates the development and adoption of chiplet architecture tailored to the automotive industry's unique demands.
Author's summary: Companies join imec's chiplet program.